Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDP
  2. Intel® C741
  3. 16 DIMM Slots up to 4TB
  4. Optional AIOM module or PCIe 5.0 x16
  5. Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
  6. Two optional storage modules. Each module supports 2x NVMe or SAS/SATA drive bays
  7. 2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
  8. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
  9. Built-in SAS3 Support via Broadcom 3808; IT Mode
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