Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Socket E (LGA 4677) support 4th Gen Intel® Xeon® Scalable processors
  2. Intel® C741
  3. Up to 16 DIMMs ECC DDR5 Slots
    • 1 PCIe 5.0 x16 (LP) slot;
    • Tool-less support
    • Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
    • Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  4. Network connectivity via AIOM (OCP 3.0 compliant)
    • 6 hot-swap 2.5″ drive bays (2x PCIe 5.0 NVMe/SAS and 4x PCIe 4.0 NVMe/SAS)
    • Built-in SAS3 Support via Broadcom 3908; IT Mode
    • 4 cooling fans per 2U enclosure, 16K RPM; Shared Cooling Design, Counter-Rotating
    • Liquid Cooling Support
  5. 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
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