Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDP
  2. Intel® C741
  3. 16 DIMM Slots up to 4TB
  4. Optional AIOM module or PCIe 5.0 x16
  5. Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
  6. Two optional storage modules. Each module supports 2x NVMe or SATA drive bays
  7. 2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
  8. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
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